Power Integrations, a provider of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has introduced a wide-creepage package option for its InnoSwitch™3-AQ flyback automotive switcher IC, designed to meet the stringent requirements of next-generation EVs.
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ROHM has announced the development of a new lineup of surface-mount silicon carbide (SiC) Schottky barrier diodes (SBDs) designed to meet the evolving demands of high-voltage systems in xEVs and industrial applications. The SCS2xxxNHR series offers significant improvements in insulation resistance through an innovative package design that increases creepage distance, supporting enhanced safety and performance. […]
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The Tessenderlo, Belgium-headquartered Melexis has announced the global market launch of its MLX90424, a streamlined, integrated automotive brake pedal sensing module for enhanced vehicle safety and precision. This all-in-one solution combines dual Triaxis® position-sensing ICs together with a power-saving magnetic activation switch for reduced design complexity and optimized functional safety and performance.
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Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced the TLX9150M, an automotive photorelay designed for use in 400V electric vehicle (EV) battery systems.
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Alpha and Omega Semiconductor Limited (AOS) has announced the expansion of its package options for second-generation 650V to 1200V αSiC MOSFETs. This portfolio expansion is aimed at critical applications such as xEV charging, solar inverters, and industrial power supplies. By offering more package options, AOS provides engineers with the flexibility to optimize their systems while […]
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